Dual Beam Focused Ion Beam /
Field Emission Scanning Electron Microscope (FIB/FESEM)
Model: Helios G4 UX
Helios G4 UX
is a
dual beam FIB/FESEM system,
containing both a focused Ga+ ion beam and an ultra-high resolution field
emission scanning electron column and their combined use. The combination of
FIB and FESEM enables simultaneously imaging during FIB milling/deposition
and accurate monitoring of progress with FESEM.
Combined
with advances in patterning and a suite of accessories, the system should be
available to perform direct milling and fabrication of 2D and 3D micro-and nano-structures, rapid preparation of ultra-thin lamella
samples for TEM and needles for atom probe tomography. In addition, metal and
oxide pattern deposition can be performed.
Specifications |
Focused Ion Beam (FIB) |
Phoenix
ion column with superior high current and low voltage
performance ·
Ion
Gun: Gallium liquid metal ion
source ·
Ion beam current
range: 0.1 pA - 65
nA ·
Accelerating voltage
range: 500 V - 30 kV ·
Maximum horizontal
field width: 0.9 mm at beam coincidence point ·
Detector:
ion conversion and electron
(ICE) detector for secondary
ions (SI) and electrons (SE) |
Scanning Electron Microscope (SEM) |
Ultra - high resolution field
emission SEM ·
Electron
Source: thermal Schottky
field emitter with
UC+ monochromator ·
Electron
beam current range: 0.8 pA - 100 nA ·
Accelerating
voltage range: 350 V - 30 kV ·
With
electron beam deceleration mode (BDM),
curtailing charging on nonconductive specimens and improving low KV performance ·
Landing energy range: 20 eV - 30 keV ·
Electron
beam resolution at coincident point: 1.2 nm @ 1.0 kV ·
Detectors:
-
Everhart-Thornley Detector (ETD) for secondary electrons (SE) and backscattered electrons (BSE) -
Through
Lens Detector (TLD) for high resolution SE / BSE imaging -
Retractable low voltage, high contrast
directional solid-state backscatter electron detector (DBS) |
Accessories: |
·
Gas
Injection System (GIS) for beam induced deposition, gas source available: - Platinum (Pt) deposition - Tungsten (W) deposition - Insulator deposition ·
EasyLift™ for precise in situ sample
manipulation, mainly used for thin section TEM specimen pick-up and mounting ·
Equipped
with a IR camera for viewing sample/column ·
Equipped
with an optical camera for sample navigation ·
Equipped
with a loadlock chamber for quick sample exchange ·
With
plasma cleaner integrated in the chamber to remove contamination ·
With
cryo decontamination device to reduce contamination |